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1/13 www.rohm.com 2009.05 - rev.a ? 2009 rohm co., ltd. all rights reserved. charge protection ic series with built-in fet standard protection type bd6040gul, bd6041gul descriptions the bd6040 gul , bd6041gul charger protection ic developed fo r portable devices provides up to 28v of over voltage protection for charger ics. built-in circuits include overvolt age lockout,overcurrent limit, undervoltage protection, internal start up delay, and status flag. features 1) 28v (max) overvoltage protection 2) low quiescent current (45 a) 3) low ron (125m ? ) fet 4) overvoltage lockout (ovlo) circuit 5) undervoltage lockout (uvlo) circuit 6) internal 2msec start up delay 7) overcurrent protection circuit 8) compact package: vcsp50l 1(1.6mm x 1.6mm, t=0.55mm) applications mobile phones, mp3 players, digital still camera, pda, ic re corder, electronic dictionary, handheld game, game controller, camcorder, bluetooth headsets, etc line up parameter over voltage lockout (in=increasing) over voltage lockout (hysteresis) package bd6040gul 6.40v 30mv vcsp50l1 bd6041gul 5.85v 100mv vcsp50l1 absolute maximum ratings (ta = 25 ) contents symbol rating unit conditions input supply voltage 1 vmax1 -0.3 30 v in1,in2,in3,in4 input supply voltage 2 vmax2 -0.3 7 v other power dissipation pd 725 mw operating temperature range topr -35 +85 storage temperature range tstr -55 +150 1 when using more than at ta=25 , it is reduced 5.8 mw per 1 .(rohm specification board 50mm 58mm mounting.) recommended operating range (ta=-35 +85 )) parameter symbol range unit usage input voltage range v in 2.2 28 v this product is not especially designed to be protected from radioactivity. no.09031eat01 downloaded from: http:///
bd6040gul, bd6041gul technical note 2/13 electrical characteristics (unless otherwise noted, ta = 25 ? c, in=5v) parameter symbol device rating unit conditions min. typ. max. electrical input voltage range vin bd6040/41 - - 28 v supply quiescent current icc bd6040/41 45 90 a under voltage lockout uvlo bd6040/41 2.53 2.65 2.77 v in= decreasing under voltage lockout hysteresis uvloh b d6040/41 50 100 150 mv in= increasing over voltage lockout ovlo bd6040 6.2 6.4 6.6 v in= increasing bd6041 5.7 5.85 6.0 v over voltage lockout hysteresis ovloh bd6040 10 30 50 mv in= decreasing bd6041 50 100 150 mv current limit ilm bd6040/41 1.2 - - a vin vs. vout res. ron bd6040/41 - 125 150 m ? ok output low voltage okvo bd6040/41 - - 400 mv sink=1ma ok leakage current okleak bd6040/41 - - 1 a en input voltage (h) enh bd6040/41 1.45 - - v en input voltage (l) enl bd6040/41 - - 0.5 v en input current enc bd6040/41 12 25 50 a en=1.5v timings start up delay ton bd6040/41 - 2 4 msec ok going up delay tok bd6040/41 - 10 15 msec output turn off time toff bd6040/41 - 2 10 sec alert delay tovp bd6040/41 - 1.5 10 sec * this product is not especially designe d to be protected from radioactivity. downloaded from: http:///
bd6040gul, bd6041gul technical note 3/13 typical operating characteristics the test conditions for the typical operating char acteristics are in=5v, cin=1uf, cout=0.1uf, rok=100k , ta=25 , unless otherwise noted fig. 1 start up 0 5v fig. 2 input steps 0 30v fig. 3 input steps 5 30v fig. 4 input steps 30 5v fig. 5 output short circuit fig. 6 output short circuit (zoom) in out ok in out ok in out ok in out ok out io ok in out io ok in downloaded from: http:///
bd6040gul, bd6041gul technical note 4/13 0 1 2 3 4 5 6 7 -50 -30 -10 10 30 50 70 90 110 130 150 temp[] ovlo[v] 0 50 100 150 200 250 300 350 400 234567 in[v] ron[m] fig. 7 icc vs. input voltage (0-30v) fig. 8 icc vs. input voltage (0-7v) fig. 9 icc vs. temperature (in=5v) fig. 10 uvlo/ovlo vs. temperature fig. 11 ron vs. input voltage fi g. 12 ron vs. te mperature (in=5v) 0 50 100 150 200 250 300 350 400 -50 -30 -10 10 30 50 70 90 110 130 150 temp[] ron[m] 0 20 40 60 -50-30-101030507090110130150 temp[] icc[ua] 0 50 100 150 200 250 300 0 5 10 15 20 25 30 in[v] icc[ua] 0 10 20 30 40 50 60 70 80 90 100 01234567 in[v] icc[ua] en=h(off) en=l(on) en=h en=l en=h en=l ovlo uvlo downloaded from: http:///
bd6040gul, bd6041gul technical note 5/13 block diagram fig. 13 block diagram package dimensions(vcsp50l1) bd6040gul is 6040, bd6041gul is 6041. fig. 14 package dimensions initial delay in 2 uvlo tsd ovlo osc vref timing generato r initial delay gate driver a 1 b1 a 2 a 3 c 1 in1 ok out2 out 1 c 3 in 3 b 2 in4 b3 c 2 en gnd 50k ? 10k ? lot no. part number bottom view downloaded from: http:///
bd6040gul, bd6041gul technical note 6/13 ball configuration fig. 15 ball configuration pin descriptions no. pin name i/o esd diode function in gnd 1 a2 in1 i - bypass with 1uf ceramic capacitor or larger to get full 15kv esd protection (air, iec61000-4-2) at the input 2 a3 in2 i - 3 b2 in3 i - 4 b3 in4 i - 5 a1 out1 o - output voltage pin 6 b1 out2 o - 7 c3 gnd - - ground pin 8 c1 ok o - active-low open drain output to signal if the adapter voltage is correct 9 c2 en i - enable input drive en high to turn off out (hi-z output) bottom view top view downloaded from: http:///
bd6040gul, bd6041gul technical note 7/13 equivalent circuit fig. 16 block diagram typical application circuit 8 rav atr arr fig. 17 application circuit ? safety is high because it detects, and it protects it for an abnormal voltage up to 28v. ? it contributes to the miniaturization because all external is built into. : : : downloaded from: http:///
bd6040gul, bd6041gul technical note 8/13 timing diagram ovlo uvlo 2msec 10msec (tok) (ton) in out ok fig. 18 start up sequence fig. 19 shutdown by over voltage detection fig. 20 operation by current limit detection ovlo uvlo 1.5 sec 2.0 sec (toff) (tovp) in out ok icc out o k ilm h downloaded from: http:///
bd6040gul, bd6041gul technical note 9/13 examples of application circuit (ball configuration is bottom view) a: in case of both en & ok pins are connected. fig. 21 b: in case of ok pin is connected. fig. 22 bd 6040 bd 6041 in out pmic / charge r a dapte r / usb ok out out en in in gnd in in 1 2 3 c b a ok out out en in in gnd in in 123 cb a o r gnd short open ok cpu en 1 . 0 f 0.1 f 10k ? li- ion 1 cell 100k ? bd 6040 bd 6041 in out ok cpu en pmic / charger a dapte r / usb gnd o k out out en in in gnd in in 123 c b a 1 .0 f 0. 1 f 10k ? li- ion 1 cell 100k ? downloaded from: http:///
bd6040gul, bd6041gul technical note 10/13 c: in case of en pin is connected. fig. 23 d: in case of both en & ok pins are not connected. fig. 24 bd6040 bd6041 in out pmic / charge r a dapte r / usb gnd ok out out en in in gnd in in 1 2 3 c b a ok out out en in in gnd in in 123 c b a o r gndshort open ok en 1.0f 0.1f li-ion 1 cell ok out out en in in gnd in in 1 2 3 c b a o r gnd short bd 6040 bd 6041 in out ok cpu en pmic / charge r a dapte r / usb gnd ok out out en in in gnd in in 123 cb a open 1 .0 f 0.1f li -ion 1 cell downloaded from: http:///
bd6040gul, bd6041gul technical note 11/13 notes foer use (1) absolute maximum ratings if applied voltage (vdd, vin), operating temperature range (top r), or other absolute maximum ratings are exceeded, there is a risk of damage. since it is not possible to identify short, open, or other damage modes, if special modes in which absolute maximum ratings are exceeded are assumed, consid er applying fuses or other physical safety measures. (2) recommended operating range this is the range within which it is possible to obtain roughly the expected characteristics. fo r electrical characteristics, it is those that are guaranteed under the conditions for each parameter. even when these are within the recommended operating range, voltage and temperatur e characteristics are indicated. (3) reverse connection of power supply connector there is a risk of damaging the lsi by reverse connection of the power supply connector. for prote ction from reverse connection, take measures such as externally placing a diode between the power supply and the power supply pin of the lsi. (4) power supply lines in the design of the board pattern, make power supply and gnd line wiring low impedance. when doing so, although the digital power supply and analog power supply are the same potential, separate the digital power supply pattern and analog power supply pattern to deter digital noise from entering the analog power supply due to the common impedance of the wiring patterns. similarly ta ke pattern design into acc ount for gnd lines as well. furthermore, for all power supply pins of the lsi, in conjun ction with inserting capacitors between power supply and gnd pins, when using electrolytic capacitors, determine constant s upon adequately confirming that capacitance loss occurring at low temperatures is not a problem for vari ous characteristics of the capacitors used. (5) gnd voltage make the potential of a gnd pin such that it will be the lowest potentia l even if operating below t hat. in addition, confirm that there are no pins for which the potential becomes less than a gnd by ac tually including transition phenomena. (6) shorts between pins and misinstallation when installing in the set board, pay adequate attention to or ientation and placement discrep ancies of the lsi. if it is installed erroneously, there is a risk of lsi damage. there also is a risk of damage if it is shorted by a foreign substance getting between pins or between a pin and a power supply or gnd. (7) operation in strong magnetic fields be careful when using the lsi in a strong magnetic field, since it may malfunction. (8) inspection in set board when inspecting the lsi in the set board, since there is a risk of stress to the lsi when capacitors are connected to low impedance lsi pins, be sure to discharge for each process. mo reover, when getting it on and off of a jig in the inspection process, always connect it after turning off the power supply, perform the inspection, and remove it after turning off the power supply. furthermore, as countermeasures against static electricity, use grounding in the assembly process and take appropriate care in transport and storage. (9) input pins parasitic elements inevitably are formed on an lsi structure du e to potential relationships. because parasitic elements operate, they give rise to interference with circuit operat ion and may be the cause of malf unctions as well as damage. accordingly, take care not to apply a lower voltage than gnd to an input pin or use the lsi in other ways such that parasitic elements operate. moreover, do not apply a voltage to an input pin when the power supply voltage is not being applied to the lsi. furthermore, when the power supply voltage is being applied, make each input pin a voltage less than the power supply voltage as well as within the gu aranteed values of electrical characteristics. (10) ground wiring pattern when there is a small signal gnd and a la rge current gnd, it is recommended that you separate the large current gnd pattern and small signal gnd pattern and provide single point grounding at the reference point of the set so that voltage variation due to resistance components of the pattern wiring and large currents do not cause the small signal gnd voltage to change. take care that the gnd wiring pattern of externally attached components also does not change. (11) externally attached capacitors when using ceramic capacitors for externally attached capacitors, determine constants upon taking into account a lowering of the rated capacitance due to dc bias and ca pacitance change due to factors such as temperature. (12) thermal shutdown circuit (tsd) when junction temperatures become 170c (typ) or higher, the thermal shutdown circuit operates and turns a switch off. the thermal shutdown circuit, which is aime d at isolating the lsi from thermal runa way as much as possible, is not aimed at the protection or guarantee of the lsi. therefore, do not c ontinuously use the lsi with this circuit operating or use the lsi assuming its operation. (13) thermal design perform thermal design in which there are adequate margins by taking into account the permissible dissipation (pd) in actual states of use. downloaded from: http:///
bd6040gul, bd6041gul technical note 12/13 0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1 0 10 20 30 40 50 60 70 80 90 100 110 120 130 140 150 ambient temperature : ta [c] power dissipation : pd [w] pd=0.725w ta_max=85c -5.8mw/c power dissipation on the rohms specification board fig. 25 power dissipation vs. ta downloaded from: http:///
bd6040gul, bd6041gul technical note 13/13 ordering part number b d 6 0 4 0 g u l - e 2 part no. part no. bd6040 bd6041 package gul : vcsp50l1 packaging and forming specification e2: embossed tape and reel (unit : mm) vcsp50l1 (bd6040gul) s 0.08 s a b ba 0.05 1pin mark 3 0.3 0.1 9- 0.25 0.05 1.6 0.1 2 ( 0.15)index post c 1 0.3 0.1 b 0.55max 1.6 0.1 a 0.1 0.05 p=0.5 2 p=0.5 2 ? order quantity needs to be multiple of the minimum quantity. embossed carrier tape tapequantity direction of feed the direction is the 1pin of product is at the upper left when you hold reel on the left hand and you pull out the tape on the right hand 3000pcs e2 () direction of feed reel 1pin (unit : mm) vcsp50l1 (bd6041gul) s 0.08 s a b ba 0.05 1pin mark 3 0.3 0.1 9- 0.25 0.05 1.6 0.1 2 ( 0.15)index post c 1 0.3 0.1 b 0.55max 1.6 0.1 a 0.1 0.05 p=0.5 2 p=0.5 2 ? order quantity needs to be multiple of the minimum quantity. embossed carrier tape tapequantity direction of feed the direction is the 1pin of product is at the upper left when you hold reel on the left hand and you pull out the tape on the right hand 3000pcs e2 () direction of feed reel 1pin downloaded from: http:///
datasheet d a t a s h e e t notice - ge rev.002 ? 2014 rohm co., ltd. all rights reserved. notice precaution on using rohm products 1. our products are designed and manufac tured for application in ordinary elec tronic equipments (such as av equipment, oa equipment, telecommunication equipment, home electroni c appliances, amusement equipment, etc.). if you intend to use our products in devices requiring ex tremely high reliability (such as medical equipment (note 1) , transport equipment, traffic equipment, aircraft/spacecra ft, nuclear power controllers, fuel c ontrollers, car equipment including car accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or serious damage to property (specific applications), please consult with the rohm sale s representative in advance. unless otherwise agreed in writing by rohm in advance, rohm shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of any ro hms products for specific applications. (note1) medical equipment classification of the specific applications japan usa eu china class class class b class class class 2. rohm designs and manufactures its products subject to strict quality control system. however, semiconductor products can fail or malfunction at a certain rate. please be sure to implement, at your own responsibilities, adequate safety measures including but not limited to fail-safe desi gn against the physical injury, damage to any property, which a failure or malfunction of our products may cause. the following are examples of safety measures: [a] installation of protection circuits or other protective devices to improve system safety [b] installation of redundant circuits to reduce the impact of single or multiple circuit failure 3. our products are designed and manufactured for use under standard conditions and not under any special or extraordinary environments or conditio ns, as exemplified below. accordin gly, rohm shall not be in any way responsible or liable for any damages, expenses or losses arising from the use of an y rohms products under any special or extraordinary environments or conditions. if you intend to use our products under any special or extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of product performance, reliability, etc, prior to use, must be necessary: [a] use of our products in any types of liquid, incl uding water, oils, chemicals, and organic solvents [b] use of our products outdoors or in places where the products are exposed to direct sunlight or dust [c] use of our products in places where the products ar e exposed to sea wind or corrosive gases, including cl 2 , h 2 s, nh 3 , so 2 , and no 2 [d] use of our products in places where the products are exposed to static electricity or electromagnetic waves [e] use of our products in proximity to heat-producing components, plastic cords, or other flammable items [f] sealing or coating our products with resin or other coating materials [g] use of our products without cleaning residue of flux (ev en if you use no-clean type fluxes, cleaning residue of flux is recommended); or washing our products by using water or water-soluble cleaning agents for cleaning residue after soldering [h] use of the products in places subject to dew condensation 4. the products are not subjec t to radiation-proof design. 5. please verify and confirm characteristics of the final or mounted products in using the products. 6. in particular, if a transient load (a large amount of load applied in a short per iod of time, such as pulse. is applied, confirmation of performance characteristics after on-boar d mounting is strongly recomm ended. avoid applying power exceeding normal rated power; exceeding the power rating under steady-state loading c ondition may negatively affect product performance and reliability. 7. de-rate power dissipation (pd) depending on ambient temper ature (ta). when used in seal ed area, confirm the actual ambient temperature. 8. confirm that operation temperat ure is within the specified range described in the product specification. 9. rohm shall not be in any way responsible or liable for fa ilure induced under deviant condi tion from what is defined in this document. precaution for mounting / circuit board design 1. when a highly active halogenous (chlori ne, bromine, etc.) flux is used, the resi due of flux may negatively affect product performance and reliability. 2. in principle, the reflow soldering method must be used; if flow soldering met hod is preferred, please consult with the rohm representative in advance. for details, please refer to rohm mounting specification downloaded from: http:///
datasheet d a t a s h e e t notice - ge rev.002 ? 2014 rohm co., ltd. all rights reserved. precautions regarding application examples and external circuits 1. if change is made to the constant of an external circuit, pl ease allow a sufficient margin considering variations of the characteristics of the products and external components, including transient characteri stics, as well as static characteristics. 2. you agree that application notes, re ference designs, and associated data and in formation contained in this document are presented only as guidance for products use. theref ore, in case you use such information, you are solely responsible for it and you must exercise your own independent verification and judgment in the use of such information contained in this document. rohm shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of such information. precaution for electrostatic this product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. please take proper caution in your manufacturing process and storage so that voltage exceeding t he products maximum rating will not be applied to products. please take special care under dry condit ion (e.g. grounding of human body / equipment / solder iron, isolation from charged objects, se tting of ionizer, friction prevention and temperature / humidity control). precaution for storage / transportation 1. product performance and soldered connections may deteriora te if the products are stor ed in the places where: [a] the products are exposed to sea winds or corros ive gases, including cl2, h2s, nh3, so2, and no2 [b] the temperature or humidity exceeds those recommended by rohm [c] the products are exposed to di rect sunshine or condensation [d] the products are exposed to high electrostatic 2. even under rohm recommended storage c ondition, solderability of products out of recommended storage time period may be degraded. it is strongly recommended to confirm sol derability before using products of which storage time is exceeding the recommended storage time period. 3. store / transport cartons in the co rrect direction, which is indicated on a carton with a symbol. otherwise bent leads may occur due to excessive stress applied when dropping of a carton. 4. use products within the specified time after opening a humidity barrier bag. baking is required before using products of which storage time is exceeding the recommended storage time period. precaution for product label qr code printed on rohm products label is for rohms internal use only. precaution for disposition when disposing products please dispose them proper ly using an authorized industry waste company. precaution for foreign exchange and foreign trade act since our products might fall under cont rolled goods prescribed by the applicable foreign exchange and foreign trade act, please consult with rohm representative in case of export. precaution regarding intellectual property rights 1. all information and data including but not limited to application example contained in this document is for reference only. rohm does not warrant that foregoi ng information or data will not infringe any intellectual property rights or any other rights of any third party regarding such information or data. rohm shall not be in any way responsible or liable for infringement of any intellectual property rights or ot her damages arising from use of such information or data.: 2. no license, expressly or implied, is granted hereby under any intellectual property rights or other rights of rohm or any third parties with respect to the information contained in this document. other precaution 1. this document may not be reprinted or reproduced, in whol e or in part, without prior written consent of rohm. 2. the products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written consent of rohm. 3. in no event shall you use in any wa y whatsoever the products and the related technical information contained in the products or this document for any military purposes, incl uding but not limited to, the development of mass-destruction weapons. 4. the proper names of companies or products described in this document are trademarks or registered trademarks of rohm, its affiliated companies or third parties. downloaded from: http:///
datasheet datasheet notice C we rev.001 ? 2014 rohm co., ltd. all rights reserved. general precaution 1. before you use our pro ducts, you are requested to care fully read this document and fully understand its contents. rohm shall n ot be in an y way responsible or liabl e for fa ilure, malfunction or acci dent arising from the use of a ny rohms products against warning, caution or note contained in this document. 2. all information contained in this docume nt is current as of the issuing date and subj ec t to change without any prior notice. before purchasing or using rohms products, please confirm the la test information with a rohm sale s representative. 3. the information contained in this doc ument is provi ded on an as is basis and rohm does not warrant that all information contained in this document is accurate an d/or error-free. rohm shall not be in an y way responsible or liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccur acy or errors of or concerning such information. downloaded from: http:///

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